Verfahren zum Herstellen eines biegsamen elektrischen Verbinders.

摘要

A flexible interconnect circuit having at least two connected components within its periphery is formed with electrically conductive traces (38) on a nonconductive plastic support (40). The components are interconnected to each other, and to external locations, with the interconnect circuit. As part of the manufacturing process, the conductive traces are typically electroplated with gold. The traces must be contacted as electrodes during electrodeposition, and the contacting is done using bus connectors along the periphery of the support. Isolated traces, not contacting the periphery and typically extending only between the components wihin the periphery, are contacted by providing removable bus connectors on the nonconductive support. when plating is complete, the removable bus connectors are removed, preferably by die cutting away portions of those portions of the support having the unneeded bus connectors.