STRESS-RESISTANT SEMICONDUCTOR CHIP-CIRCUIT BOARD INTERCONNECT

摘要

A stress-resistant semiconductor chip-circuit board (8) interconnect in which at least one semiconductor chip (5) is adhered face down by simultaneously reflowed solder bumps (7) to a circuit-bearing face of a sheet of resin (4) having minimum elastic modulus, which is adhesively adhered to a circuit board (1), the circuits of the interconnect being in electrical contact through conductively plated holes (9, 10) in the resin sheet and circuit board and the solder bumps in registration with the contact pads (2) thereof.