| 摘要 |
A TAB method is known to manufacture an electrical component by bonding a semiconductor on a film carrier made of synthetic resin, then punching the lead of the film carrier, and bonding a device obtained by punching to a circuit board. A bonding of a semiconductor to a film carrier as described above is called "an inner lead bonding". Bonding a punched device to a circuit board is called "an outer lead bonding". In the invention, the film carrier fed from the supply reel is punched by a punching unit, and the device obtained by punching is picked up by a bonding head. Then, the positional deviation of the lead of the device picked up with respect to the electrode of the circuit board is detected by the optical means. Subsequently, the positional deviation of the lead is corrected, the device is placed on the circuit board, and the lead is fusion-bonded to the electrode of the circuit board.
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