| 摘要 |
PURPOSE:To place a chip forming material in a desired thickness on a surface of a lower mold by pressing an upper mold into the lower mold, and compression-forming the material between the surface of the lower mold and a surface of the upper mold. CONSTITUTION:Chip forming molds 11 has a lower mold 12 having a protruding surface 12A and an upper mold 13 having a recess surface 13A. A chip forming material 15 is placed in the mold 12. The material 15 is charged in a gap 14C of vertical and lateral plate walls 14A, 14B of a lattice framelike core 14 on the surface 12A of the mold 12. The material 14 in the gap 14C is prevented from being slidably falling from the surface 12A of the mold by the wall 14A. Accordingly, the material 15 can be placed in a uniform thickness on the surface 12A of the mold 12. The mold 12 is moved down in this state to compression- form the material 15, and brought into contact with steam to cure urethane polymer. |
