Chip part handling apparatus

摘要

First and second aligning portions each having a plurality of parallel downwardly sloped grooves, are inclinedly arranged to communicate with a chip box containing a plurality of chip parts at random. The chip box and the first aligning portion are supplied with vibration, to serially align the chip parts in the grooves of the first aligning portion. The chip parts are then received in the grooves of the second aligning portion. The first of the chip parts thus received in the second aligning portion are received in a plurality of receiving cavities provided in a separable portion respectively, so that the chip parts received in the receiving cavities are simultaneously discharged by a suction chuck.