发明名称 Embossing metal hold
摘要 According to the present invention, etching is used to form a concave and convex pattern corresponding to information on an embossing metal mold comprising a conductive layer and a layer which includes an Ni electric-plating layer, or an Ni electric-plating layer, so that the surface of the embossing metal mold will not be contaminated even if processing conditions are somewhat changed, and that the mold will have less defects. Thus, optical disk substrates of high quality can be produced. Besides, time required for manufacturing a stamper can be shortened.
申请公布号 US5338178(A) 申请公布日期 1994.08.16
申请号 US19910800455 申请日期 1991.11.27
申请人 HITACHI, LTD. 发明人 KATO, KEIZO;HORIGOME, SHINKICHI;SUZUKI, RYO;ITO, MASARU
分类号 B29D17/00;G11B7/26;(IPC1-7):B29C59/00 主分类号 B29D17/00
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