| 摘要 |
<p>The package for improving the heat radiation ratio includes a lead frame (1) with a lead frame pad (20) placed close to an inner lead (22), a pattern tape (30) with a mounting window (32) for defining the chip area, wiring lines (34), and pads (P1,P2), a chip (3) mounted by the window, a first wire (28) wiring a chip pad (26) and the pad (P1), and a second wire (38) wiring the inner lead and the pad (P2). The package is molded by a resin.</p> |
