| 摘要 |
PURPOSE:To easily change the pitch of leads at the time of mounting SOPICs having a shorter lead-to-lead pitch on a printed board on which pads for longer pitches are set. CONSTITUTION:The title changing board 1 is a printed board having a surface peripheral shape similar to the peripheral shape of an SOPIC 2 meeting the EIAJ package standard, with the size of the board 1 being slightly larger than that of the SOPIC 2. The width of the board 1 is nearly equal to the width- direction lead-to-lead pitch of the SOPIC meeting the JEDEC package standard. The board 1 is provided with pads 1a for SOPIC 2 on the surface and recessed sections 1b respectively counterposed to the pads 1a on both side faces in the width direction and conductor foil formed in the sections 1b are connected to their corresponding pads 1a on the surface. The sections 1b are soldered to pads 3 for SOPIC meeting the JEDEC package standard. In addition, the sections 1b has semicircular or semiellipse shapes. |
