| 摘要 |
<p>PURPOSE:To provide a lead structure of surface mount IC which can reduce generation of solder bridge. CONSTITUTION:A pad-to-pad pitch is set two times the lead pitch in a lead structure of a surface mount IC by alternately arranging a J type lead 2 and a gull-wing type lead 1 or by alternately arranging gull-wing type leads of different lengths.</p> |
