| 摘要 |
PURPOSE:To provide a semiconductor device in which the damage of the electrodes of a semiconductor chip brought about when the inner leads of a lead frame is brought into contact with the electrodes of the semiconductor chip can be prevented and also the semiconductor chip can be surely connected to the lead frame. CONSTITUTION:A double-sided adhesive tape 6 is placed between a semiconductor 1 with electrodes 4 formed on the surface and the inner leads 3 of a lead frame made of a conductive material and is temporarily fastened by thermocompression bonding and at the same time the electrodes 4 and the inner leads 3 are interconnected by plating, and the tips of the inner leads 3 are brought into contact with the electrodes 4 of the semiconductor chip 1 in advance and at the same time a soft metal-plating 8 is formed in at least one tip part nearer to the tip-side part than the double-sided adhesive tape 6 of the inner leads 3. |
