| 摘要 |
PURPOSE:To provide a semiconductor device in which the damage of the electrode of a semiconductor chip can be prevented by relaxing a stress applied to the semiconductor chip when a lead frame and an inner lead are brought into contact with each other and also the semiconductor chip and the lead frame can be surely connected. CONSTITUTION:A double-sided adhesive tape 6 is placed between a semiconductor chip 1 with electrodes 4 formed on the surface and the inner leads 3 of a lead frame 2 made of a conductive material and is temporarily fastened by thermo compression bonding and at the same time the electrodes 4 of the semiconductor chip 1 and the inner leads 3 are interconnected by plating, and the tips of the inner leads 3 is brought into contact with the electrodes 4 of the semiconductor chip 1 in advance and at the same time a notch is provided in a least one place nearer to the tip-side part than the double-sided adhesive tape 6 of the inner leads 3. |
