| 摘要 |
PURPOSE:To prevent a bonding wire formation pattern resist from coming off by patterning at a thick film position of a resist film. CONSTITUTION:A first electrode layer is formed simultaneously when a first layer of a bonding pad 12 is formd. An interlaminar insulation film 13 is formed with polyimide group resin, thereby forming a through hole 14 and exposing the surface of the first layer 12. A second layer electrode material layer is formed so that a photoresist layer may be formed with a rotary coating method. A mask pattern 17 is formed at the position expanded from the end of the first layer 12 and at a thick film position of a resist film, thereby forming a second layer 18. |
