| 摘要 |
PURPOSE:To securely connect the end part of inner lead with a pad and prevent damage on the pad. CONSTITUTION:Since an inner lead 11 is formed of two layers of metal materials having different thermal expansion coefficients, for instance, 42 alloy 12 and Cu alloy 13, with the 42 alloy 12 having a small thermal expansion coefficient provided in the side of pad 4, the inner lead 11 allows the Cu alloy 13 having a larger thermal expansion coefficient to elongate, and thereby deflects toward the 42 alloy 12 having the smaller thermal expansion coefficient. With this deflection, the end part of the inner lead 11 is to be in contact with the pad 4 of the semiconductor chip 2. |
