| 摘要 |
PURPOSE:To securely exhaust absorbed water contents by integrating a hanging pin provided in connection with a bed portion and individual inner lead nearest the handing pin to form a wider area. CONSTITUTION:An inner lead 11 end is arranged around a bed portion 10 keeping a certain gap thereto and a fine metal lead 12 is extended like a constant loop between electrodes of a semiconductor element to be mounted and the inner lead 11. One handing pin 13 and one of the inner leads 11 corresponding thereto are reduced to form, on the contrary, a wider region 15 on the hanging pin 13. However, interval of the other inner leads 11 is not changed and exhaust areas of absorbed water contents are selected at the three positions a, b, c on the surface of the resin sealing layer. After a semiconductor is mounted on SOP lead frame providing such hanging pin 13 and the mold process is carried out to improve absorbed water content exhausting effect. Thereby, cracks which are caused by expansion of water contents within the sealing resin can be prevented. |
