| 摘要 |
PURPOSE: To provide a micro-pin package by which the number of input and output lines between an LSI chip, etc. and a substrate can remarkably be increased. CONSTITUTION: This micro-pin package is composed of a plurality of micro-pin sheets, each of which is produced by uniting a carrier 19, a plurality of micro- pins 12, a pair of supporting posts, and a supporting frame 20 which supports the micro-pin sheets 10 arranged at prescribed intervals. The supporting frame 20 is composed of a bottom plate 21 having a rectangular aperture 21a and a plurality of guide plates 25 layered on the bottom plates and a plurality of guide grooves 25b are formed in opposed two sides of the rectangular apertures 25a of the guide plates 25 to give a plurality of continuous guide grooves 25b connected vertically to one another. Supporting posts 11 are inserted into the guide grooves 25b and micro-pin sheets 10 are installed. The micro-pins 12 are supported on the supporting frame 20 while being arranged in an array state. |
