| 摘要 |
PURPOSE:To obtain a bypass capacitor which is capable of being close to an IC board and being aligned, demanding for only a minimum area on the front surface of both the IC board and a carrier board by connecting the IC board to a plurality of individual interconnecting elements installed to a carrier board by way of a dielectric substance. CONSTITUTION:A chip or a board 10 is partially connected to a plurality of individual interconnecting elements 30 and 40 installed to a carrier board 20 by way of a dielectric substance, thereby forming an interconnecting capacitor as a bypass capacitor for noise filtration in an IC module which comprises a chip which constitutes an integrated circuit or the board 10 and the carrier board 20 which loads more than one board. More specifically, a first solder bump 30' is installed to a first board 10 while a second solder bump 40', which covers the dielectric substance 50 on the surface of a joint part as opposed to the solder bump 30' on the second board 20 which faces the board 10. The solder bumps 30' and 40' are subjected to reflow, thereby contact-bonding them by way of the dielectric substance layer 50. |
