| 摘要 |
PURPOSE:To prevent the formation of a microcrack or a damage area on a thin type package by minimizing the application of a stress to the thin type package when processing a gate. CONSTITUTION:A first cutting process is carried out, which forms a preliminary cutting crack 60 on a connection part between a thin type package 20 and a gate 30. Then, a second cutting process in carried out, which cuts the crack portion 60 formed by the first cutting process and separates the thin type package 20 from the gate 30 completely. |
