MANUFACTURE OF SEMICONDUCTOR WAFER

摘要

PURPOSE:To provide a GaAs wafer excellent in process accuracy by a method wherein the wafer is corrected in 'warpage' generated in a slice process without deteriorating in thickness dispersion. CONSTITUTION:A semiconductor wafer manufacturing method is provided with a process wherein a semiconductor wafer 1 pasted on a polishing plate after it is sliced and etched is lapped, wherein the semiconductor wafer 1 is pasted on a polishing plate with no pressure after it is sliced and etched. Therefore, a semiconductor wafer is pasted on a polishing plate as it is kept the same in shape after it is sliced and etched.