| 摘要 |
<p>PURPOSE:To prevent heat from escaping due to heat conduction to a support member from a flat substrate by a method wherein a conductor interconnection and a groove part are formed on the support-member face of the flat substrate on which a temperature-dependent thin-film resistor has been formed. CONSTITUTION:A temperature-dependent resistor 12 as a platinum film is formed on an alumina flat-sheet substrate 11. Then, parts other than an electrode- extraction terminal 12a are coated with a glass paste or the like, a protective film 13 is formed, and a metal thin film 14 for bonding to a support member 16 is laminated on the terminal 12a by a printing method or the like. Thereby, a thin-film resistor element 10 is manufactured. The element 10 is bonded to a conductor interconnection 15 on the support member 16, and a groove 16a is formed in the support member 16. Since the conductor inter-connection 15 is formed on the support member 16 and the element 10 is bonded directly, heat does not escape from a wire. In addition, since the groove part 16a is formed, a heat-insulating layer 19 by the air is constituted, a face from which heat escapes to the support member 16 is reduced, and its temperature rise is reduced. Thereby, the measuring error of the title sensor is reduced.</p> |
