Low-strain polyimide composition, and solution of its precursor composition

摘要

The invention relates to a solution of a polyimide precursor composition which comprises: a tetracarboxylic acid component containing not less than 70 mol% of at least one compound selected from the group consisting of benzene tetracarboxylic acid and a reactive derivative thereof; a maleinimide compound; and a diamine component containing not less than 70 mol% of 2,2'-substituted 4,4'-benzidine, represented by the formula (I), and siloxydiamine in an amount of from 1 to 10 mol%, <IMAGE> R are identical or different radicals selected from the group consisting of CF3, CH3, C2H5, OCH3, OC2H5, Cl, Br and phenyl. The tetracarboxylic acid components, the maleinimide compound and the diamine component are dissolved in a solvent essentially comprising gamma -butyrolactone. The amount of the tetracarboxylic acid component is essentially equivalent to that of the diamine component. The amount of the maleimide compound is from 5 to 30% by weight of the total weight of the tetracarboxylic acid and diamine components. A polyimide film produced from the solution of the polyimide precursor has very low residual strain and has better adhesion to the substrate, has a very flat (planar) surface and, if desired, can be treated with an etching solution which is not harmful.