发明名称 |
Method for molding a semiconductor package on a continuous leadframe |
摘要 |
A method and apparatus for sealing a semiconductor wherein an upper seal block of a cope and a lower seal block of a drag are provided with sealants for nipping a portion of a long size lead frame, so that the airtightness of a cavity enclosed with the cope and drag can be completely kept. The long size lead frame may have a continuing part extending from one of two side members to the other, provided between adjacent lead patterns to be pressed by the sealants, so that the airtightness of the cavity can be further completely kept. |
申请公布号 |
US5336272(A) |
申请公布日期 |
1994.08.09 |
申请号 |
US19920876306 |
申请日期 |
1992.04.30 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
TSUTSUMI, YASUTSUGU;TANAKA, SUEYOSHI |
分类号 |
B29C45/14;H01L21/56;(IPC1-7):H01L21/28;H01L21/60;B28B7/00;B29C43/22 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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