发明名称 RESIN MOLDING DEVICE AND CONTROL THEREOF
摘要 PURPOSE:To easily mold a resin molded product having an extremely thin package and to facilitate gate break. CONSTITUTION:A pot 10 and a cavity 12 are allowed to communicate with each other by a resin passage 24 and a molten resin is sent to the cavity 12 under pressure from the pot 1 through the resin passage 24 to be subjected to resin molding. Gate runner pins 14a, 14b having flat end surfaces are arranged at the gate end positions of the cavity 12 and retracted at the time of the filling of the cavity 12 with the resin to open the resin passage and, after the cavity 12 is filled with the resin, the gate runner pins 14a, 14b are allowed to protrude and the end surfaces thereof are brought into contact with a product to be molded to close the resin passage 24 to perform resin molding.
申请公布号 JPH06218754(A) 申请公布日期 1994.08.09
申请号 JP19930012249 申请日期 1993.01.28
申请人 APIC YAMADA KK 发明人 MIYAJIMA FUMIO
分类号 B29C45/02;B29C45/14;B29C45/26;B29C45/28;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/02
代理机构 代理人
主权项
地址