发明名称 |
Method of covering substrate surface with sintered layer and powdery raw material used for the method |
摘要 |
A method of covering a substrate surface with a sintered layer comprises the step of loading a powdery raw material in a region of forming a sintered layer on the surface of a substrate, and the step of sintering the loaded powdery raw material so as to form a sintered layer on the surface of the substrate. The powdery raw material contains at least two elements and has a temperature region in which a solid phase and a liquid phase are present together. The liquid phase is wettable with the substrate. The sintering step is performed within a temperature region in which the solid phase and the liquid phase of the powdery raw material are present together.
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申请公布号 |
US5336527(A) |
申请公布日期 |
1994.08.09 |
申请号 |
US19910797952 |
申请日期 |
1991.11.26 |
申请人 |
TOSHIBA MACHINE CO., LTD. |
发明人 |
TAKAHASHI, SAKAE;UMEHARA, MINORU |
分类号 |
B22F7/08;B32B15/01;C23C24/10;(IPC1-7):B05D3/12 |
主分类号 |
B22F7/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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