Single in-line optical package

摘要

An optical packaging arrangement is disclosed which utilizes silicon technology and overmolding techniques to provide a single in-line package with completely passive alignment between the various optical components. The technique as disclosed is useful in the packaging of a single active optical device and associated electronics, a pair of optical devices and electronics (transceiver), or an array of any desired number of such components. Since the silicon may be processed to include etched alignment fiducials and metallized bond pad sites, solder bump self-alignment and silicon optical bench technology may be used to provide for alignment between the active device, coupling lens and associated optical fiber.