| 摘要 |
PURPOSE:To enable the electric test of a semiconductor chip to be conducted prior to mounting it on a circuit board and to enable this semiconductor chip to be mounted on the circuit board in high density by providing a bonding mechanism for flip-chip bonding of the semiconductor chip to the circuit board. CONSTITUTION:Inner leads of a film carrier to which a semiconductor chip 1 is connected by inner lead bonding are cut at portions in the vicinity of the semiconductor chip 1. With cut-pieces 15a of the inner leads attached to the semiconductor chip 1, the semiconductor chip is held by a second bonding tool 28, a printed board 5 is pressurized and heated. And the cut pieces 15a of the inner leads and a wiring pattern 6 of the printed board 5 are bonded. |
