| 摘要 |
<p>PURPOSE:To inexpensively obtain a highly reliable leadframe by making a semiconductor element mounting section of alloy, containing aluminum as the principal component, or aluminum whose junction regions come into contact with inner leads are subjected to an insulation treatment, and by joining tip ends of the inner leads to the semiconductor mounting section via an adhesive layer. CONSTITUTION:A number of inner leads 1, with tip ends thereof being joined to upper part of an aluminum oxide layer 2S, which radially extend and outer leads 3, each extending in line with each inner lead 1, are formed in an integrated fashion. The tip ends of the inner leads 1 and the semiconductor element mounting section 2 are joined to each other via insulating adhesive 4 applied between them. The semiconductor chip and the inner leads 1 are joined to each other by bonding wires 6, and the outside of the semiconductor chip is then sealed by bonding resin 9. Thereby, the tip ends of the inner leads 1 are fixed at appropriate positions, and hence a highly reliable semiconductor device can be obtained without causing connection failure.</p> |
