| 摘要 |
<p>PURPOSE:To provide a package structure for single in-line package type semiconductor device which can sufficiently clear severe vibration resistant properties required for vehicle mounted downsized package. CONSTITUTION:In a single in-line package type semiconductor device, a stand-off part 3a is formed at the root of a lead 3 led out from a resin package 1 and posts 1a to be fit in fixing holes 6a made in the surface of a printed wiring board 6 are provided at at least the opposite ends of the package in parallel with the row of the leads. The printed wiring board and the resin package are interconnected through the posts under a state where the printed wiring board is mounted with components. This constitution protects the leads against direct application of external vibratory load at the time of practical use thus enhancing the vibration resistant properties of fixing structure.</p> |
