CONSTITUENT OF IC CHIP AND ITS PREPARATION

摘要

PURPOSE: To realize a technique of electronic package which allows a wire to strain while a die is molded avoiding shortcircuiting by providing an optimum coating material around a wire. CONSTITUTION: The component is comprised of an IC chip 1 with an electric conductive part 3 in an upper part, an electric conductive lead 5 and an electric conductive wire 4 which connects an electric conductive part 3 and the electric conductive lead 5 and whereto coating 6 of an insulating substance is applied uniformly. That is, all the conductive leads 5 have the electric conductive wire 4 connecting it to the conductive part 3. The wire 4 is heated to a typical wire bonding temperature and is thereby combined. Thereafter, the insulation coating 6 is adapted to the wire 4. Here, it is important to cover a wire with the insulation coating 6 after the conductive part 3 and the conductive lead 5 are connected by a wire.