LEAD FRAME AND ITS MANUFACTURE, AND MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT USING IT

摘要

PURPOSE:To improve the resistance to reflow crack of an LSI package, and provide a lead frame suitable for the manufacture of a small quantity of diversified LSI packages. CONSTITUTION:The bonding area between a semiconductor chip 2 and resin is enlarged by making the dimensions of the external form of a die pad 3 larger than the those of the external form of a semiconductor chip 2 mounted thereon. Moreover, it is made possible to mount each kind of semiconductor chips 2 different in the dimensions of external form on the die pad 3 by cutting the top of a lead 5 into proper length, according to the dimensions of the external form of the semiconductor chip 2.