| 摘要 |
PURPOSE: To obtain a novel method for forming relaxation and mutual interconnection of a low position wire by using an automatic gold wire ball bonder by making a bonding tool move continuously from a first ball bond to a second ball target position and extruding a wire forward. CONSTITUTION: The method is for forming interconnection of a wire 11 between a first bonding target and a second bonding target. A capillary bonding tool 12 is pulled up, the wire 11 of a specified length which is shorter than a length of a wire to be used for final mutual interconnection is drawn out, the wire 11 is clamped by a clamp, second bond formation is started by moving the capillary bonding tool 12 to a first position immediately before final second bond on a second bonding target, clamping of the wire 11 is released, the capillary bonding tool 12 is moved to a final position of a second bonding target and a second bond which is enlarged by performing further bonding treatment for the wire 11 is formed. |
