| 摘要 |
PURPOSE:To provide a semiconductor device sealed with resin which can detect a current accurately by lessening the ripple of a resistance value by the mounting of a chip resistor for current detection. CONSTITUTION:A semiconductor element 5 for output is mounted on a lead frame 1, and a semiconductor element 7 for control is mounted on a lead frame 3. Moreover, chip resistors 15 and 16 for current detection are mounted in parallel by solder or the like between the lead frames 2 and 3. Hereby, the increment of the resistance by the mounting of resistors for current detection can be decreased, and the improvement of accuracy in current detection, the reduction of power consumption, and the improvement of freedom in mounting can be materialized. |
