LEADFRAME, AND MANUFACTURE OF LSI PACKAGE USING THE SAME

摘要

PURPOSE:To provide a burr-free leadframe, and to provide a method for manufacturing an LSI package using this leadframe. CONSTITUTION:A leadframe 10 is provided with a die pad section 12 to which a semiconductor element 2 is die-bonded, and lead sections 13, with front ends thereof being opposite to this die pad section 12, which are connected to the semiconductor element 2 via wires 20. Projections 17 are formed at the front end of the lead section 13, and hence sealing resin will not escape toward the rear of the lead section 13 further from the position where the projections 17 are provided.