| 摘要 |
PURPOSE:To improve the assembling work when a solid-state image pickup element is positioned and fixed and to enhance the bonding strength. CONSTITUTION:An mounting device is provided with a 1st metallic fixture 24 fixed to a light emitting face of a spectrum prism 21 and with a 2nd metallic fixture 25 opposite to the 1st metallic fixture and to which the solid-state image pickup element is fixed. Then when legs 24A, 25A used to bond the 1st and 2nd metallic fixtures are soldered by using solder or the like, the melting face of the legs is limited by a solder resist layer or the like. |
