| 摘要 |
PURPOSE:To manufacture high-reliability multilayer printed boards by forming a copper oxide layer on the surface of an inner copper foil layer in an inner circuit board before the formation of a circuit patter, and grinding the copper oxide layer mechanically into a this and rough copper oxide film. CONSTITUTION:Patterning of a glass-cloth base epoxy resin double copper-clad laminate is performed by circuit formation by the use of UV hardening resin, and it is used for an inner circuit board. Next, this is dipped in an aqueous solution of H2O2 34g/l and H2SO4 46g/l for two minutes, and the surfaces are made rough by etching. After that, it is cleansed with dilute hydrochloric acid. Next, the copper-clad laminate is washed with water sufficiently and dipped in an aqueous solution of NaClO4 30g/l, NaOH 25g/l, Na2PO4.2H2O 5g/l; temperature 85 deg.C for two minutes, and a copper oxide layer 3 is formed and washed with water. Next, the copper-clad laminate having the copper oxide layer is ground with a #600 buff, and washed with water sufficiently. After being dried, it is baked at 105 deg.C for 30 minutes to make an inner circuit board 2. |
