| 摘要 |
<p>PURPOSE:To enhance the alignment accuracy of two works to be bonded remarkably and to make it possible to automate bonding perfectly. CONSTITUTION:A work 1, which is held with a holding collet 3, is made to face a work 2 on a movable table 5 by the movement of the holding collet 3. Both works are precisely aligned with an precise positioning device. Then, the work 1, which is held with the holding collect 3, is contact-bonded to the other work 2. Thus, both works 1 and 2 are bonded with this automatic die bonder. The precise positioning device is constituted of a solid image sensing device 7 and a process control part. The solid image sensing device 7 can be moved, can detect the positions of both works 1 and 2 and can photograph the respective works 1 and 2 in the direction perpendicular to the surfaces to be photographed. The process control part computes the relative position deviation of both works 1 and 2 based on the detected signals from the solid image sensing device 7 and controls the movement of the movable table. The solid image sensing device 7 can photograph both works 1 and 2 in the same field of view.</p> |
