发明名称 |
JIG FOR HOLDING SEMICONDUCTOR WAFER |
摘要 |
<p>PURPOSE:To make it possible to ensure a uniform thermal conductivity while preventing contamination of a heavy metal. CONSTITUTION:In a jig for holding a semiconductor wafer used in a wafer chuck for holding the semiconductor wafer of an alloy 8 containing copper, a chrome carbide coating 9 for controlling a precipitation of the copper is applied to at least the holding surface of the semiconductor wafer of the alloy 8, and diffusion of a heavy metal is prevented.</p> |
申请公布号 |
JPH06216222(A) |
申请公布日期 |
1994.08.05 |
申请号 |
JP19930005700 |
申请日期 |
1993.01.18 |
申请人 |
HITACHI LTD |
发明人 |
FUKADA HIROSHI;MITSUI KATSUHIRO;TAKAISHI MASARU |
分类号 |
C23C16/44;C23C16/458;C30B35/00;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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