发明名称 JIG FOR HOLDING SEMICONDUCTOR WAFER
摘要 <p>PURPOSE:To make it possible to ensure a uniform thermal conductivity while preventing contamination of a heavy metal. CONSTITUTION:In a jig for holding a semiconductor wafer used in a wafer chuck for holding the semiconductor wafer of an alloy 8 containing copper, a chrome carbide coating 9 for controlling a precipitation of the copper is applied to at least the holding surface of the semiconductor wafer of the alloy 8, and diffusion of a heavy metal is prevented.</p>
申请公布号 JPH06216222(A) 申请公布日期 1994.08.05
申请号 JP19930005700 申请日期 1993.01.18
申请人 HITACHI LTD 发明人 FUKADA HIROSHI;MITSUI KATSUHIRO;TAKAISHI MASARU
分类号 C23C16/44;C23C16/458;C30B35/00;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 C23C16/44
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