| 摘要 |
PURPOSE:To provide a manufacturing method for a small, thin, light, and low- cost printed wiring board, which meets a demand that an electronic apparatus is made small easily. CONSTITUTION:In a manufacturing step, a conductive circuit 4 is formed on a flexible board 2 made of elastic epoxy, and at least a place of the conductive circuit 4 that is not covered with a rigid board 3 is coated with an elastic epoxy adhesive 8. Then, the epoxy adhesive 8 is applied to a given place in the bonding face of the rigid board 3 so that the flexible board 2 and the rigid board 3 are bonded. After an outer layer conductor circuit 6 is formed in a conventional way, a place for a bending part 9 is exposed in the flexible board. |
