发明名称 ELECTROSTATIC CHUCK, MANUFACTURE THEREOF, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE TRANSFER APPARATUS
摘要 PURPOSE:To provide an electrostatic chuck further serving as a substrate placing part and a manufacture thereof in which attraction is strong and resistance to wear, resistance to heat, resistance to plasma, vacuum properties, surface smoothness and resistance to insulation are good and thermal conductivity and strength are high. CONSTITUTION:An electrostatic chuck comprises a substrate placing part 10 made of a metal further serving as an electrode and a ceramic plate 12 bonded on the surface of the substrate placing part 10 with a low-temperature brazing material 14. In a manufacture of the electrostatic chuck, after the ceramic plate 12 is bonded to the surface of the substrate placing part 10 made of the metal further serving as the electrode with the low-temperature brazing material 14 by a low-temperature brazing method, the surface of the ceramic plate 12 is polished and is shaped to a desired thickness.
申请公布号 JPH06216224(A) 申请公布日期 1994.08.05
申请号 JP19930019462 申请日期 1993.01.13
申请人 SONY CORP 发明人 KIKUCHI KAZUO
分类号 B23Q3/15;B65G49/07;H01L21/027;H01L21/205;H01L21/265;H01L21/302;H01L21/3065;H01L21/677;H01L21/68;H01L21/683;H02N13/00;(IPC1-7):H01L21/68 主分类号 B23Q3/15
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