| 摘要 |
<p>PURPOSE:To provide a terminal structure of a semiconductor package with a simple constitution, in which it is possible to directly connect terminals of a semiconductor package to leads of other electronic components and wiring material without the use of a printed board or an IC socket. CONSTITUTION:A through-hole 11 is formed in a ceramic package 1, and a perforated metal terminal 12 is brazed to a lower surface of the ceramic package 1 with brazing material 4 in such a way that the perforated metal terminal is connected to the through-hole 11. Each pin terminal 3 is inserted into and soldered to a through-hole 21a formed in a printed board 21 by solder 22. Wiring material 23 is inserted into the through-hole 11 and a hole 12a from the upper surface side of the ceramic package 1, and the wiring material 23 is brazed to the perforated metal terminal 12 along the inner wall surface of the hole 12a by brazing material 24 such as Ag paste or solder. Hence, the wiring material 23 is electrically connected to a semiconductor element 6 via the perforated element 12 without the use of the printed board 21.</p> |
