| 摘要 |
<p>PURPOSE:To obtain an electronic device wherein the packaging density of an electronic component in a wiring board is high by a method wherein the electronic component is mounted in a through hole and on a film board having a wiring board structure closing the through hole. CONSTITUTION:A through hole 4 is formed at a desired part in a wiring board 1, film boards 5, 6 are pasted on the surface and the back of the wiring board 1 so as to close it. Solders 12 are formed on desired surfaces of wiring layers 10, and they are bonded to wiring layers 2 on the wiring board 1. Thereby, the film boards 5, 6 are pasted on the wiring board 1 so as to close the through hole 4. Then, a semiconductor chip 7 is fixed, via a silver paste 16, to a chip mounting pad 5 formed of the wiring layer 10 on the surface of the film board 6 inside the through hole 4, and its electrodes and the desired wiring layer 10 on the surface of the film board 6 are connected electrically by wires 17. Consequently, the through hole is closed by the film boards composed of a wiring board structure, and an electronic component is mounted on the film board inside the through hole. Consequently, the packaging density of the electronic component can be enhanced.</p> |
