发明名称 ELECTRONIC DEVICE PACKAGE ASSEMBLY
摘要 PURPOSE: To provide an electronic-device package assembly which maintains a base member and a cover member parallel to a lead frame easily and with a low cost. CONSTITUTION: A lead frame 116 is provided between a base member 112 and a cover member 114. An electronic device 122 is attached on a support pad 136 and provided between the base member 112 and the cover member 114. A bubble down member 152 and a bubble up member 150 formed on a support pad arm 138 are respectively provided between the base member 112 and the lead frame 116 and between the lead frame 116 and the cover member 114, to maintain predetermined intervals between the base member 112 and the lead frame 116 and between the cover member 114 and the lead frame 116. By this construction, the base member 112 and the cover member 114 can be maintained parallel to the lead frame 116.
申请公布号 JPH06216266(A) 申请公布日期 1994.08.05
申请号 JP19930343151 申请日期 1993.12.15
申请人 HEWLETT PACKARD CO <HP> 发明人 RUISU TOOMASU MIRUZU
分类号 H01L23/02;H01L23/04;H01L23/057;H01L23/10;H01L23/495 主分类号 H01L23/02
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