Chip carrier for surface mount devices

摘要

A pin grid array is formed as a chip carrier (1). The chip carrier has pins (2) on the underside, and bushes (4) on the top side which are not necessarily electrically connected to the pins below. The chip carriers can be stacked using the pins and bushes.One side of the chip carrier is free of contacts. A cooling plate (10) is inserted over this side which conducts the heat loss to regions outside the chip carrier. A connector is formed on one of the sides.