Polyamides with improved impact strength, etc. used mouldings for electronal use

摘要

Polyamide materials (I) contg. 0.1-1 wt.% tetephthalic dialdehyde (II) and/or acetals thereof with 1-4C alcohols (III) are claimed.Also claimed are the prepn. of (I) by mixing the components with the polyamide, melting and opt. extruding the mixt. and a process for increasing the impact strength, notched impact strength and viscosity of fire-resistant, halogen-free polyamides by adding 3-30 wt.% melamine and/or melamine cyanurate (IV) and 0.1-1 wt.% (II) and/or (III), and a process for increasing the mol. wt. of polyamides in the melt by addn. of 0.1-1 wt.% (II) and/or (III).