| 摘要 |
PURPOSE:To provide a manufacturing method for thermal heads which can be completed in a short operating time and also of high yield by simultaneously removing a conductor wiring layer between conductor wiring and on a thermal resistor and a resist, and allowing an etching to be done to a thermal resistor layer between wiring without contact of the etchant with a conductor wiring. CONSTITUTION:A thermal resistor layer 2 composed of Ta2N, Ta-Si, Ta-SiO2, etc. of 0.05-0.2mum is formed on the surface of a high resistance substrate 1 by evaporation or sputtering. Then a conductor layer consisting of Au, Al, etc. ranging from 0.5-2mum in thickness is formed. In addition, an unnecessary part of the conductor layer is etched using a regist pattern 4. Next, after removing the regist pattern 4, the unnecessary part of the thermal resistor layer is again etched using the regist pattern 5. Here, if the regist pattern 5 is removed, a thermal resistor is formed. Consequently, a conductor layer on the thermal resistor and a conductor layer between the conductor wiring are etched simultaneously, thus shortening an operating time. |
