Semiconductor device having a plurality of chips having identical circuit arrangements sealed in package.

摘要

A semiconductor device includes a first chip (20, 20A, 120) having a circuit arrangement, and a plurality of first terminals (D) formed on a main surface of the first chip and substantially arranged into a line. The semiconductor device also includes a second chip (22, 22A, 122) having a circuit arrangement identical to that of the first chip, and a plurality of second terminals (D') formed on a main surface of the second chip and substantially arranged into a line. The first and second chips are arranged in a predetermined direction perpendicular to the main surfaces of the first and second chips. The semiconductor device also includes a plurality of connecting members (R, R', P) connected to the first terminals and the second terminals and provided for external connections.