| 摘要 |
<p>The disclosure relates to a method for depositing sequential thin films on glass substrates by single substrate deposition comprising loading a batch of substrates into a load lock chamber and evacuating the chamber, transferring the substrates to a batch heating chamber for heating the substrates to elevated temperatures; transferring the glass substrates singly to one or more single substrate processing chambers, and sequentially transferring the substrates back to the load lock chamber where they are batch cooled. The disclosure also relates to a vacuum system for carrying out the method includes a load lock/cooling chamber (14A, 14B) for evacuating a plurality of glass substrates; a heating chamber (28) for heating a plurality of substrates to elevated temperatures; one or more single substrate processing chambers (40, 42, 44, 46); and a transfer chamber (12) having access to all of said chambers and having automated means (22) therein for transferring the glass substrates into and out of said chambers in a preselected order. <IMAGE></p> |
