发明名称 GRINDING DEVICE
摘要 PURPOSE:To finish a material of high hardness or hard and brittle material to have a mirror surface easily by finely positioning a grinding wheel spindle having a grinding wheel at a resolution of a sub-micron or less. CONSTITUTION:A piezoelectric element is inside a fine positioning device 3, and by expanding this piezoelectric element, the fine positioning device 3, a grinding wheel spindle 1, and a grinding wheel 2 are displaced to generate a cut in a work. The piezoelectric element is capable of obtaining a positioning resolution, so the grinding wheel can cut the work at the resolution of a sub- micron or less. Because of this provision of the grinding wheel spindle 1, and the positioning device 3 to position the grinding wheel spindle 1 finely at the resolution of a sub-micron or less, the grinding wheel spindle 1 can be finely positioned at the resolution of a sub-micron or less. A plain surface, a spherical, or a non-spherical surface can thus be grinding-finished to have a mirror surface easily.
申请公布号 JPH06210533(A) 申请公布日期 1994.08.02
申请号 JP19930004629 申请日期 1993.01.14
申请人 RICOH CO LTD 发明人 ENOMOTO TOSHIYUKI
分类号 B23Q1/00;B23Q1/34;B23Q5/28;B23Q15/22;B24B47/10;B24B49/00 主分类号 B23Q1/00
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