| 摘要 |
PURPOSE:To shorten exchanging time taken for changing type of a resin seal type semiconductor device by mounting a pot side mold having a plurality of pots in a transfer molding device and detachably arranging, on the pot side mold, first and second cavity side molds whose cavity sizes and the arranging number vary. CONSTITUTION:A lower mold of a mold 3 is divided into a pot side mold and cavity side molds, and the pot side mold 30 is mounted in a transfer molding device. The pot side mold 30 is equipped with a plurality of pots 301A, 301B which have the same pot diameter and are arranged in the same direction at the same pitch, which are made to be connectable with both of the cavity side molds 31S and 31B. The cavity side molds 31S and 31B have a plurality of cavities 313S and 313B corresponding to type of a resin seal type semiconductor device. They are connected to a main runner 311 through resin gates 312, respectively. When the cavity side mold 31S is mounted, only the pots 301A work actually. |
