| 摘要 |
PURPOSE:To prevent deterioration in quality of a resin seal type semiconductor device caused by resin chips, in a transfer molding device. CONSTITUTION:In a transfer molding device 1, cavities 313 of a mold 3 are arranged in other area than a moving passage between a tablet charging section 42 of tablet supply sections 41 in a loader side frame conveying body 4 and pots 311 of the mold 3. |
