发明名称
摘要 PURPOSE:To obtain a die being capable of improving the controllability of film thickness by providing a cooling means for controlling the temp. heat- conducted from a supplementary heating means in a heat-conducting path between a pushing/pulling transmitting device and a die opening and by keeping the temp. of the die main body almost constant and at a desired temp. CONSTITUTION:A cooling means is provided near a pushing/pulling transmitting device 3. The effect of the cooling means is to keep the temp. near die opening 6 at an almost same temp. as the temp. of a main heating device 2 by letting a heating medium of a specified temp. flow in a path of heating medium to offset nearly the amt. of conductive heating and the amt. of cooling. The cooling capacity being balanced with the amt. of heat conducted to the vicinity of the lip opening 6 through the pushing/pulling transmitting device 3, etc. among the amt. of heat given to the pushing/pulling transmitting device 3 by a supplementary heating means 4 is enough for a cooling device.
申请公布号 JPH0655407(B2) 申请公布日期 1994.07.27
申请号 JP19860009978 申请日期 1986.01.22
申请人 发明人
分类号 B29C47/16;B29L7/00;(IPC1-7):B29C47/16 主分类号 B29C47/16
代理机构 代理人
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